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Ranked by model assessment and recency. Labels use the original model impact, not expected returns. Impact percentages are model estimates, not observed price changes, probabilities or guaranteed returns.
NVIDIA’s high-end GPUs rely heavily on TSMC’s leading-edge nodes and advanced packaging, so tighter supply or faster AI demand improves TSMC’s utilization and order visibility.
Also named: ASML · AMAT · LRCX · TSM · 9988.HK · SMCI
The Taiwan-listed parent directly benefits from stronger AI foundry demand and a higher mix of advanced packaging revenue, improving earnings expectations and valuation.
Also named: TSM · UMC · AMAT · LRCX · ASML · 3711.TW
Advanced-node orders from Nvidia and other AI-chip customers are concentrated at TSMC, so stronger AI demand directly lifts utilization and long-run capex returns at its leading-edge fabs.
Also named: ASML · KLAC · AMAT · NVDA · AVGO · AMD
Nvidia’s AI-chip ramp typically relies on TSMC’s leading-edge foundry and packaging capacity, so the expansion supports sustained demand for TSMC’s high-end wafer and packaging services.
Also named: NVDA · AMD · AVGO · MU · 000660.KS · 005930.KS
If Nvidia’s high-end GPU shipments become more cautious amid Asian policy friction, it can soften expectations for advanced-node order cadence and capacity scheduling, though TSMC remains diversified and AI demand is still robust.
Also named: NVDA · 6857.TW · MSFT · GOOGL · SMCI · DELL
As NVIDIA's sole foundry for advanced-node GPUs, the long-term purchase commitments further lock in revenue visibility for its CoWoS and advanced packaging capacity.
Also named: NVDA · AMD · AVGO · ASML · AMAT · MU
Apple is one of the largest customers for advanced-node capacity, so improved iPhone and device shipment expectations lift TSMC’s visibility on leading-edge orders.
Also named: AAPL · 005930.KS · 2317.TW · 2498.TW · ASML · AVGO
Stronger-than-expected Apple end-demand helps sustain healthy demand for advanced-node and premium mobile-chip foundry orders.
Also named: AAPL · QCOM · SWKS · HPQ · DELL · MU
TSMC is the manufacturing base of Taiwan’s custom-silicon ecosystem, so more ASIC tape-outs and advanced-packaging demand directly improve order visibility.
Also named: MRVL · TSM · AMAT · KLAC · ANET · AVGO
Advanced-node and advanced-packaging demand should stay elevated as AI servers and memory-related capacity expand, supporting wafer fab and CoWoS utilization.
Also named: 000660.KS · 005930.KS · 8035.T · AMAT · LRCX · NVDA
The rest, archived by time · 21
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